Building on our 25 years of proprietary and patented innovation for the global electronics packaging industry, Air Products has developed the Electron Attachment (EA) technology, a novel flux-free soldering technology that uses activated hydrogen at ambient pressure with a starting temperature as low as 100° C to remove metal oxides from electroplated solder bumps on semiconductor wafers and permit reflow of these bumps to obtain the proper shape and size for interconnection onto a package or substrate.